vishay tlmb310. document number 83034 rev. 1.7, 31-aug-04 vishay semiconductors www.vishay.com 1 e3 pb pb-free 19225 smd led in plcc-2 package description this device has been redesigned in 1998 replacing sic by gan technology to meet the increasing demand for high efficiency blue leds. the package of the tlmb310. is the plcc-2 (equiv- alent to a size b tantalum capacitor). it consists of a lead frame which is embedded in a white thermoplast. all leds are categorized in lumi- nous intensity groups. that allows users to assemble leds with uniform appearance. features ? gan on sic technology eia and ice standard package compatible with infrared, vapor phase and wave solder processes according to cecc available in 8 mm tape non-diffused lens: excellent for coupling to light pipes and backlighting luminous intensity ratio in one packaging unit i vmax /i vmin 1.6 esd class 1 lead-free device applications automotive: backlighting in dashboards and switches telecommunication: indicator and backlighting in telephone and fax indicator and backlight for audio and video equipment indicator and backlight in office equipment flat backlight for lcds, switches and symbols general use parts table absolute maximum ratings t amb = 25 c, unless otherwise specified tlmb310. part color, luminous intensity angle of half intensity ( ? ) technology tlmb3100 blue, i v > 4.0 mcd 60 gan on sic tlmb3101 blue, i v = (4.0 to 12.5) 60 gan on sic tlmb3104 blue, i v = (5.0 to 12.5) 60 gan on sic tlmb3106 blue, i v = (5.0 to 20.0) 60 gan on sic parameter test condition symbol value unit reverse voltage v r 5v dc forward current t amb 60 c i f 20 ma surge forward current t p 10 si fsm 0.1 a power dissipation t amb 60 c p v 100 mw junction temperature t j 100 c operating temperature range t amb - 40 to + 100 c
www.vishay.com 2 document number 83034 rev. 1.7, 31-aug-04 vishay tlmb310. vishay semiconductors optical and electrical characteristics t amb = 25 c, unless otherwise specified blue tlmb310. 1) in one packing unit i vmax /i vmin 1.6 typical characteristics (t amb = 25 c unless otherwise specified) storage temperature range t stg - 40 to + 100 c soldering temperature t 5 s t sd 260 c thermal resistance junction/ ambient mounted on pc board (pad size > 16 mm 2 ) r thja 400 k/w parameter test condition part symbol min ty p. max unit luminous intensity 1) i f = 10 ma tlmb3100 i v 4.0 8.0 mcd tlmb3101 i v 4.0 12.5 mcd tlmb3104 i v 5.0 12.5 mcd tlmb3106 i v 5.0 20.0 mcd dominant wavelength i f = 10 ma d 466 nm peak wavelength i f = 10 ma p 428 nm angle of half intensity i f = 10 ma ? 60 deg forward voltage i f = 20 ma v f 3.9 4.5 v reverse voltage i r = 10 av r 5v parameter test condition symbol value unit figure 1. power dissipation vs. ambient temperature 100 80 60 40 0 25 50 75 100 125 p - power dissipation ( mw ) v t amb - ambient temperature ( c) 95 10904 20 0 figure 2. forward current vs. ambient temperature for ingan 0 10 20 30 40 60 i - forward current ( ma ) f 15884 50 t amb - ambient temperature ( c) 100 80 60 40 20 0
vishay tlmb310. document number 83034 rev. 1.7, 31-aug-04 vishay semiconductors www.vishay.com 3 figure 3. rel. luminous intensity vs. angular displacement figure 4. forward current vs. forward voltage figure 5. rel. luminous flux vs. ambient temperature 0.4 0.2 0 0.2 0.4 0.6 95 10319 0.6 0.9 0.8 0 30 10 20 40 50 60 70 80 0.7 1.0 i - relative luminous intensity vre l 1 10 100 v f - forward voltag e(v) 15846 f i - forward current ( ma ) 0123 45678 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 15847 i - relative luminous intensity vrel i f =10ma t amb - ambient temperature ( c) -10 10 20 30 40 50 60 70 80 90 100 0 figure 6. relative luminous flux vs. forward current figure 7. figure 8. forward current vs. pulse length 0.01 0.1 1 10 100 i f - forward current ( ma ) 15848 i - relative luminous intensity vrel 110 0 20 40 60 80 100 120 350 400 450 500 550 600 - wavelenght ( nm ) 15849 i - relative luminous intensity (%) vrel i f =10ma 10 100 1000 0.01 0.1 1 10 100 t p - pulse length ( ms ) 18816 i - forward current ( ma ) fm t p /t=1 0.02 0.05 0.1 0.2 0.5 0.01
www.vishay.com 4 document number 83034 rev. 1.7, 31-aug-04 vishay tlmb310. vishay semiconductors package dimensions in mm 95 11314 mounting pad layout 3.5 0.2 0.85 1.65 + 0.10 - 0.05 pin identification 2.8 + 0.15 2.2 ? 2.4 3 + 0.15 1.2 2.6 (2.8) 1.6 (1.9) 4 4 area covered with solder resist dimensions: ir and vaporphase (wave soldering) technical drawings according to din specifications drawing-no. : 6.541-5025.01-4 issue: 7; 05.04.04 ca
vishay tlmb310. document number 83034 rev. 1.7, 31-aug-04 vishay semiconductors www.vishay.com 5 ozone depleting substa nces policy statement it is the policy of vishay semiconductor gmbh to 1. meet all present and future national and international statutory requirements. 2. regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. it is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (odss). the montreal protocol (1987) and its london amendments (1990) intend to severely restrict the use of odss and forbid their use within the next ten years. various national and international initiatives are pressing for an earlier ban on these substances. vishay semiconductor gmbh has been able to use its policy of continuous improvements to eliminate the use of odss listed in the following documents. 1. annex a, b and list of transitional substances of the montreal protocol and the london amendments respectively 2. class i and ii ozone depleting substances in the clean air act amendments of 1990 by the environmental protection agency (epa) in the usa 3. council decision 88/540/eec and 91/690/eec annex a, b and c (transitional substances) respectively. vishay semiconductor gmbh can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. we reserve the right to make changes to improve technical design and may do so without further notice. parameters can vary in different applications. all operating parameters must be validated for each customer application by the customer. should the buyer use vishay semiconductors products for any unintended or unauthorized application, the buyer shall indemnify vishay semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. vishay semiconductor gmbh, p.o.b. 3535, d-74025 heilbronn, germany telephone: 49 (0)7131 67 2831, fax number: 49 (0)7131 67 2423
legal disclaimer notice vishay document number: 91000 www.vishay.com revision: 08-apr-05 1 notice specifications of the products displayed herein are subjec t to change without notice. vishay intertechnology, inc., or anyone on its behalf, assume s no responsibility or liability fo r any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. except as provided in vishay's terms and conditions of sale for such products, vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and /or use of vishay products including liab ility or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyrigh t, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify vishay for any damages resulting from such improper use or sale.
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